LIF-MD6000-6MG81I
6,000-cell Lattice CrossLink FPGA in csBGA-81 with two hardened MIPI D-PHY ports for compact mobile camera and display bridging.
The LIF-MD6000-6MG81I is a Lattice CrossLink FPGA with 6,000 logic cells and hardened MIPI D-PHY in an 81-ball csBGA package. CrossLink was designed for compact, power-sensitive bridging between image sensors, application processors and displays, and its hardened D-PHY meets the strict timing of MIPI links without external components. The small package and low power make it ideal for mobile phones, tablets, wearables, drones and AR or VR headsets, where board space and battery life are critical, and the programmable fabric allows sensor multiplexing, format conversion and simple image pre-processing. Typical functions include combining two cameras into a single processor input, splitting or duplicating a display stream, converting between MIPI lane configurations, and adding test or debug patterns. Because the device is programmable, a product can support new sensors or resolutions through a software update rather than a board change. CrossLink also supports secure configuration so a design is protected against cloning. Every device is factory-traceable and ships with import declaration, certificate of origin and RoHS documentation. Designers should budget the MIPI bandwidth, keep the differential pairs short and impedance-controlled, and confirm the power rails. BeiLuo holds this part in regional stock and our FAE team supports interface design and layout review.
FAE Professional Review
The LIF-MD6000-6MG81I is the small CrossLink bridge we recommend for mobile camera and display work: two hardened MIPI D-PHY ports, 6,000 cells and an 81-ball package. It multiplexes sensors or splits displays with almost no external parts. Keep the differential pairs tight and it just works.
| Parameter | Value |
|---|---|
| Series | CrossLink |
| Logic Cells | 6000 |
| Hardened IP | MIPI D-PHY x2 |
| Package | csBGA-81 |
| Temperature | -40 C to +100 C |
Application Circuits
Mobile camera and display bridging
Reference circuits and application schematics for Mobile camera and display bridging are available from our FAE team.
Wearables and drones
Reference circuits and application schematics for Wearables and drones are available from our FAE team.
AR and VR sensor aggregation
Reference circuits and application schematics for AR and VR sensor aggregation are available from our FAE team.
Need a reference schematic or design review? Our FAE engineers can share verified circuits and layout guidance for this part.
Related Documents
Alternative Part Numbers
| Model | Package | Note | Action |
|---|---|---|---|
| LIFCL-40-9BG256C | caBGA-256 | CrossLink-NX for higher density and four MIPI lanes | View |
Complementary Part Numbers
| Model | Package | Note | Action |
|---|---|---|---|
| iCE40UP5K-SG48I | QFN-48 | iCE40 for always-on sensor pre-processing | View |
| LFD2NX-40-8BG256C | caBGA-256 | Certus-NX for the host interface and control | View |
Recommended Complementary Products
Frequently Asked Questions
What projects suit the LIF-MD6000-6MG81I?
It fits compact mobile and wearable products that need to bridge or multiplex MIPI camera and display links, such as combining two cameras into one processor input or splitting a display stream, where space and power are tight.
The hardened D-PHY avoids external bridge parts.
CrossLink or CrossLink-NX?
Choose CrossLink for the smallest, lowest-power bridging where two MIPI ports and a small fabric are enough. Choose CrossLink-NX when you need more logic, more MIPI lanes, PCIe and lower power from FD-SOI for a fuller image pipeline.
Our FAE team can match the device to your interface.
Is the part genuine and documented?
BeiLuo supplies factory-traceable LIF-MD6000-6MG81I devices through Lattice's authorized channel, with import declaration, certificate of origin and RoHS files on every order. The class is normally held in stock.
Request a sample to validate your bridge design.